Dynamics of an ultrasonic transducer used for wire bonding
نویسندگان
چکیده
منابع مشابه
Performance Study of an Ultrasonic Transducer used for Wire Bonding
-In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreem...
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Ultrasonic energy is widely used in wire bonding for microelectronics packaging. It is necessary to ensure that the maximum ultrasonic vibration displacement occurs at or near the tip of the bonding tool (capillary) for optimal performance. In this study, amplitude profiles of ultrasonic vibrations along capillaries were measured with load using a laser interferometer. This provided valuable in...
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Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25 m diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultraso...
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Ultrasonic transducers are integrated into the minimally invasive needles and catheters for medical diagnostic. There is a need for a model that can predict the behavior of the ultrasonic transducer. Many designers employ one dimensional analytic models, however due to certain limitations these models are not adequate to understand the entire performance of an ultrasonic transducer. Nowadays, f...
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ژورنال
عنوان ژورنال: IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
سال: 1998
ISSN: 0885-3010
DOI: 10.1109/58.738285